Gallium nitride nanostructures for light-emitting diode …
Gallium nitride, GaN, features physical characteristics that are highly promising for light-emitting diode (LED) applications [1].First, the bandgap of GaN is widely tunable in the …

Gallium nitride, GaN, features physical characteristics that are highly promising for light-emitting diode (LED) applications [1].First, the bandgap of GaN is widely tunable in the …
SEM images of the GaN templates grown under various processing conditions with and without a SiO 2 mask: [(a) and (b)] on an AlN buffer layer at high temperature and low …
Selective area thermal etching (SATE) of gallium nitride is a simple subtractive process for creating novel device architectures and improving the structural and optical quality …
This paper reviews materials challenges and recent progress for selective area regrowth and doping for vertical gallium nitride (GaN) power devices.
Gallium nitride's bandgap is equal to 3.4 eV, significantly higher than that of silicon (1.2 eV). The greater mobility of the gallium nitride electrons leads to a higher switching speed …
This paper reviews materials challenges and recent progress for selective area regrowth and doping for vertical gallium nitride (GaN) power devices.
To circumvent this, a bi-layer selective area growth mask was engineered to grow up to 3.0 µ m thick epitaxy of GaN using plasma-assisted molecular beam epitaxy as an ion …
This chapter is a general introduction to the properties and applications of gallium nitride (GaN) and related materials. In the first part, after an historical background on the relevant …
Lanthanoid-doped Gallium Nitride (GaN) integrated into nanophotonic technologies is a promising candidate for room-temperature quantum photon sources for quantum …
Gallium nitride (GaN) as a wide bandgap material has been extensively investigated for semiconductor lighting over the past decades. Epitaxial growth of GaN on …
The paper reports a phenomenon of parasitic substrate masking during selective area metalorganic vapor phase epitaxy (SA-MOVPE) of gallium nitride (GaN) using silicon …
A new approach is described for fabricating devices on each of the faces of the same gallium nitride semiconductor wafer, using the cation face for photonic devices and the …
In this study, a silicon dioxide (SiO2) mask was selectively introduced onto the lenses of a patterned sapphire substrate to suppress the growth of polycrystalline GaN. The …
SAG of cubic gallium nitride (c-GaN) by PAMBE was first reported by Meier et al. in macroscopic mask openings, employing SiO 2 as a growth mask. To research ART, ELO, …
Gallium nitride (GaN)-based devices surpass the traditional silicon-based power devices in terms of higher breakdown voltage, faster-switching speed, higher thermal …
When careful attention is paid to the lithography, the etching of the SiN x mask and also the etching of the nitride laser structure, ... Gallium nitride (GaN) and its alloys of …
Abstract Studies of the characteristics of ohmic contacts to epitaxial and ion-doped gallium-nitride layers, based on the Cr/Pt/Au metallization system, are reported. The possibility …
Selective area mass transport regrowth of GaN was performed on wafers with etched wells and SiO 2 mask. The samples were annealed in NH 3 and H 2 flow, with no …
Keywords: Gallium Nitride, Etching, Photoelectrochemistry, Trench Structure, Power Device, Superjunction Abstract Photo-electrochemical (PEC) etching was used to fabricate deep …
In this work the possibilities of Nano Selective Area Growth (NSAG) of cubic Gallium Nitride on 3C-SiC/Si (001) pseudo substrates are studied. Growth was masked by SiO2, patterned with …
In this study, a silicon dioxide (SiO 2) mask was selectively introduced onto the lenses of a patterned sapphire substrate to suppress the growth of polycrystalline GaN. The …
... form the surface relief, a protective mask based on a layer of nickel (Ni) with a thickness of 0.25 microns and a sublayer of silicon dioxide (SiO2) with a thickness of 0.3 microns was...
The geometrical aspect ratio between mask opening and mask thickness can be designed in a way that stacking faults (SFs) terminate on the SiO 2 sidewalls. This process is called trapping as the SFs cannot propagate …
... form the surface relief, a protective mask based on a layer of nickel (Ni) with a thickness of 0.25 microns and a sublayer of silicon dioxide (SiO2) with a thickness of 0.3 microns was...
In article number 2200508, Falco Meier, Donat Josef As, and co-workers present selective growth of cubic gallium nitride (c-GaN) within 20 nm openings of a nucleation mask. …